IT1063279B - Apparecchiatura per il trattamento di wafer o moduli semiconduttori - Google Patents

Apparecchiatura per il trattamento di wafer o moduli semiconduttori

Info

Publication number
IT1063279B
IT1063279B IT23207/76A IT2320776A IT1063279B IT 1063279 B IT1063279 B IT 1063279B IT 23207/76 A IT23207/76 A IT 23207/76A IT 2320776 A IT2320776 A IT 2320776A IT 1063279 B IT1063279 B IT 1063279B
Authority
IT
Italy
Prior art keywords
semiconductive
wafer
modules
treatment
equipment
Prior art date
Application number
IT23207/76A
Other languages
English (en)
Italian (it)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT1063279B publication Critical patent/IT1063279B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/04—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material with special provision for agitating the work or the liquid or other fluent material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Weting (AREA)
  • Drying Of Solid Materials (AREA)
IT23207/76A 1975-06-13 1976-05-13 Apparecchiatura per il trattamento di wafer o moduli semiconduttori IT1063279B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/586,769 US4015615A (en) 1975-06-13 1975-06-13 Fluid application system

Publications (1)

Publication Number Publication Date
IT1063279B true IT1063279B (it) 1985-02-11

Family

ID=24347045

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23207/76A IT1063279B (it) 1975-06-13 1976-05-13 Apparecchiatura per il trattamento di wafer o moduli semiconduttori

Country Status (7)

Country Link
US (1) US4015615A (en])
JP (1) JPS51151077A (en])
CA (1) CA1052665A (en])
DE (1) DE2624156C1 (en])
FR (1) FR2324376A1 (en])
GB (1) GB1531937A (en])
IT (1) IT1063279B (en])

Families Citing this family (28)

* Cited by examiner, † Cited by third party
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US4259002A (en) * 1979-02-09 1981-03-31 Thawley Clive S Plate processing apparatus
JPS58135644A (ja) * 1982-01-14 1983-08-12 Seiko Epson Corp ウエツト処理装置
US4740249A (en) * 1984-05-21 1988-04-26 Christopher F. McConnell Method of treating wafers with fluid
US4738272A (en) * 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4633893A (en) * 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4856544A (en) * 1984-05-21 1989-08-15 Cfm Technologies, Inc. Vessel and system for treating wafers with fluids
US4577650A (en) * 1984-05-21 1986-03-25 Mcconnell Christopher F Vessel and system for treating wafers with fluids
JPS61251135A (ja) * 1985-04-30 1986-11-08 Toshiba Corp 自動現像装置
EP0233184B1 (en) * 1985-06-24 1992-04-01 Cfm Technologies, Inc. Semiconductor wafer flow treatment
EP0284698A1 (en) * 1987-04-01 1988-10-05 Alberto Borondo Serrano Improvements on setting chambers for concrete parts
JPH01129403U (en]) * 1988-02-26 1989-09-04
US5107880A (en) * 1990-03-07 1992-04-28 Pathway Systems, Inc. Disk cleaning apparatus
EP0608363A1 (en) * 1991-10-04 1994-08-03 Cfmt, Inc. Ultracleaning of involuted microparts
DE4319046A1 (de) * 1993-06-08 1994-12-15 Miele & Cie Traggestell für Leiterplatten
US5678115A (en) * 1996-05-15 1997-10-14 Eastman Kodak Company Method and apparatus for processing a photosensitive material
US6136724A (en) * 1997-02-18 2000-10-24 Scp Global Technologies Multiple stage wet processing chamber
US7216655B2 (en) * 1998-01-09 2007-05-15 Entegris, Inc. Wafer container washing apparatus
US6926017B2 (en) 1998-01-09 2005-08-09 Entegris, Inc. Wafer container washing apparatus
US6543461B2 (en) * 1999-02-11 2003-04-08 Nova Measuring Instruments Ltd. Buffer system for a wafer handling system field of the invention
DE10131808A1 (de) * 2001-06-30 2003-06-05 Patrizius Payarolla Aufnahmevorrichtung für Profilrahmen
US6892740B2 (en) * 2002-01-22 2005-05-17 Teh Kean Khoon Method and apparatus for transferring chips
US7146991B2 (en) * 2002-01-23 2006-12-12 Cinetic Automation Corporation Parts washer system
US7353832B2 (en) * 2003-08-21 2008-04-08 Cinetic Automation Corporation Housingless washer
US7338565B2 (en) * 2003-08-21 2008-03-04 Cinetic Automation Corporation Housingless washer
US20090229639A1 (en) * 2008-03-14 2009-09-17 Seagate Technology Llc Particle Purge System
US10490429B2 (en) 2014-11-26 2019-11-26 Applied Materials, Inc. Substrate carrier using a proportional thermal fluid delivery system
CN104588356B (zh) * 2014-12-18 2017-04-19 吉安市优特利科技有限公司 一种铝壳锂电池清洗方法
CN114904840B (zh) * 2022-07-18 2022-11-08 山东沂光集成电路有限公司 集成电路用半导体加工的铝合金零部件清洗处理设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1114591A (en) * 1913-01-31 1914-10-20 Nellie G De Laney Dish-washing machine.
DE1403669A1 (de) * 1960-06-24 1968-10-24 Siemens Elektrogeraete Gmbh Einrichtung zur Reinigung von Gegenstaenden
DE1403671A1 (de) * 1960-08-04 1968-10-24 Siemens Elektorgeraete Gmbh Geschirrspuele
DE1503853A1 (de) * 1965-05-03 1969-05-29 Neff Werke Geschirrspuelmaschine
DE1442600A1 (de) * 1965-10-15 1969-08-28 Bergwerksverband Gmbh Anstroemboden fuer Wirbelbetten
US3765431A (en) * 1969-10-16 1973-10-16 Western Electric Co Apparatus for handling and maintaining the orientation of a matrix of miniature electrical devices
US3640792A (en) * 1970-08-07 1972-02-08 Rca Corp Apparatus for chemically etching surfaces
US3716021A (en) * 1971-03-10 1973-02-13 Ferro Corp Applicator mechanism for particulate material
JPS5110944B2 (en]) * 1971-08-23 1976-04-07
US3851758A (en) * 1972-04-26 1974-12-03 Ibm Semiconductor chip fixture
US3762426A (en) * 1972-04-26 1973-10-02 Ibm Semiconductor chip separation apparatus
SE375248B (en]) * 1973-08-08 1975-04-14 Uddeholms Ab

Also Published As

Publication number Publication date
FR2324376B1 (en]) 1979-04-20
JPS51151077A (en) 1976-12-25
DE2624156B2 (de) 1981-01-29
DE2624156A1 (de) 1976-12-30
FR2324376A1 (fr) 1977-04-15
DE2624156C1 (de) 1981-10-01
US4015615A (en) 1977-04-05
JPS5622369B2 (en]) 1981-05-25
GB1531937A (en) 1978-11-15
CA1052665A (en) 1979-04-17

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